Some Galaxy S27 models might run hotter thanks to this chip choice

At a glance:

• Samsung may drop fan-out wafer-level packaging for the Exynos 2700
• Removing FOWLP could raise temperatures on Galaxy S27 and S27 Plus devices
• New heat‑path block and side‑by‑side DRAM layout aim to mitigate the thermal impact

What the change means

Samsung is reportedly considering abandoning Fan‑Out Wafer‑Level Packaging (FOWLP) for its upcoming Exynos 2700 chipset, which is slated to power some Galaxy S27 and S27 Plus models in 2025. The decision appears driven by the high cost and yield‑risk associated with FOWLP, a process that Samsung first employed on the Exynos 2400. Industry sources note that while FOWLP delivered a “23 % bump in heat‑resistance on a single core and an 8 % improvement for multi‑core” workloads, the complexity made it unprofitable at current volumes.

The potential fallout is a hotter processor. Without the advanced thermal benefits of FOWLP, the Exynos 2700 could run at higher temperatures under load, which may affect performance throttling and user comfort. Analysts warn that Samsung’s cost‑saving move could backfire if thermal constraints force the company to limit clock speeds or redesign the phone’s internal layout.

Samsung’s cooling countermeasures

To offset the loss of FOWLP, Samsung is introducing a heat‑path block (HPB) that was first seen on the Exynos 2600 used in select Galaxy S26 and S26 Plus variants. The HPB acts as an integrated heat sink, drawing heat away from the CPU cores. Additionally, the Exynos 2700 will place DRAM alongside the processor rather than stacking it on top, allowing the HPB to cover both components simultaneously.

These architectural tweaks are intended to preserve the thermal envelope that FOWLP previously provided. By routing heat through a dedicated block and keeping memory and logic side‑by‑side, Samsung hopes to keep surface temperatures within acceptable limits even under sustained multi‑core workloads. Whether the HPB and layout changes will fully compensate remains to be seen when the devices ship.

Outlook for 2025 releases

The Galaxy S27 and S27 Plus are expected to launch sometime next year, but the exact rollout schedule has not been confirmed. If the Exynos 2700‑powered models do exhibit higher heat output, Samsung may need to issue software throttling updates or even consider a mid‑cycle hardware revision.

Consumers and reviewers will be watching benchmark results closely, especially thermal throttling curves and sustained performance metrics. Competitors that continue to use advanced packaging or alternative cooling solutions could gain a relative advantage in the premium Android segment. Until real‑world testing is possible, the industry will weigh Samsung’s cost‑saving strategy against the risk of a hotter flagship experience.